—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
David Z. Pan, Sung Kyu Lim, Krit Athikulwongse, Mo...
Designers are skilled at sketching and prototyping the look of interfaces, but to explore various behaviors (what the interface does in response to input) typically requires progr...
Brad A. Myers, Sun Young Park, Yoko Nakano, Greg M...
Embedded signal processing systems are usually associated with real-time constraints and/or high data rates so that fully software implementation are often not satisfactory. In th...
Procurement for e-Government is an important part of activities which are similar to the nature of B2B. That is usually characterized by bulk volumes with complex variables, burea...
Abstract. We present and discuss the results of an experimental analysis in the design of Boolean networks by means of genetic algorithms. A population of networks is evolved with ...
Andrea Roli, Cristian Arcaroli, Marco Lazzarini, S...