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    CORR
    2008
    Springer
    194views Education» more  CORR 2008»
    Fabrication of 3D Packaging TSV using DRIE
    14 years 9 months ago
    Fabrication of 3D Packaging TSV using DRIE
    Download  www.alcatelmicromachining.com
    Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
    M. Puech, Jean-Marc Thevenoud, J. M. Gruffat, N. L...
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    FDL
    2011
    IEEE
    191views Natural Language Processing» more  FDL 2011»
    Integrating system descriptions by clocked guarded actions
    13 years 9 months ago
    Integrating system descriptions by clocked guarded actions
    Download  www.irisa.fr
    —For the description of reactive systems, there is a large number of languages and formalisms, and depending on a particular application or design phase, one of them may be bette...
    Jens Brandt, Mike Gemunde, Klaus Schneider, Sandee...
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    AINA
    2008
    IEEE
    153views Computer Networks» more  AINA 2008»
    Fortification of IT Security by Automatic Security Advisory Processing
    15 years 4 months ago
    Fortification of IT Security by Automatic Security Advisory Processing
    Download  research.securityresearch.at
    Stefan Fenz, Andreas Ekelhart, Edgar R. Weippl
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    NOCS
    2008
    IEEE
    98views Computer Networks» more  NOCS 2008»
    Impact of Process and Temperature Variations on Network-on-Chip Design Exploration
    15 years 4 months ago
    Impact of Process and Temperature Variations on Network-on-Chip Design Exploration
    Download  async.org.uk
    Bin Li, Li-Shiuan Peh, Priyadarsan Patra
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    ANCS
    2006
    ACM
    88views Computer Networks» more  ANCS 2006»
    Symerton--using virtualization to accelerate packet processing
    15 years 3 months ago
    Symerton--using virtualization to accelerate packet processing
    Download  www.cs.wustl.edu
    Aaron R. Kunze, Stephen D. Goglin, Erik J. Johnson
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