287 search results - page 13 / 58 » Reducing Power in High-Performance Microprocessors |
80
Voted
MICRO
2006
IEEE
15 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
WCE
2007
14 years 10 months ago
2007
—The JPEG 2000 image coding standard employs the biorthogonal 9/7 wavelet for lossy compression. The performance of hardware implementation of 9/7-filter bank depends on accuracy...
ICONS
2009
IEEE
15 years 4 months ago
2009
IEEE
The power saving is one of the important issue in the embedded systems. To reduce the consumption of the microprocessor of such a system, a way is to power down it when it is inac...
PPSC
1997
14 years 11 months ago
1997
We illustrate how Fortran 90 supports object-oriented concepts by example of plasma particle computations on the IBM SP. Our experience shows that Fortran 90 and object-oriented m...
ISVLSI
2008
IEEE
15 years 4 months ago
2008
IEEE
Powerful branch predictors along with a large branch target buffer (BTB) are employed in superscalar processors for instruction-level parallelism exploitation. However, the large ...