2570 search results - page 132 / 514 » Reliability Modeling Using UML |
ICCV
2007
IEEE
15 years 4 months ago
2007
IEEE
Mole pattern changes are important cues in detecting melanoma at an early stage. As a first step to automatically register mole pattern changes from skin images, this paper prese...
DAC
2008
ACM
15 years 11 months ago
2008
ACM
1 Soft errors induced by radiation are an increasing problem in the microelectronic field. Although traditional models estimate the reliability of memories suffering Single Event U...
COMPSAC
2003
IEEE
15 years 3 months ago
2003
IEEE
The parameters in these software reliability models are usually directly obtained from the field failure data. Due to the dynamic properties of the system and the insufficiency of...
ISSRE
2010
IEEE
14 years 8 months ago
2010
IEEE
—Architecture-based software reliability analysis methods shall help software architects to identify critical software components and to quantify their influence on the system r...
ASPDAC
2012
ACM
13 years 5 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...