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ICIP
2007
IEEE
15 years 4 months ago
Automated Solder Inspection Method by Means of X-ray Oblique Computed Tomography
High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed a...
Atsushi Teramoto, Takayuki Murakoshi, Masatoshi Ts...
ISLPED
2006
ACM
103views Hardware» more  ISLPED 2006»
15 years 3 months ago
Low power light-weight embedded systems
Light-weight embedded systems are now gaining more popularity due to the recent technological advances in fabrication that have resulted in more powerful tiny processors with grea...
Majid Sarrafzadeh, Foad Dabiri, Roozbeh Jafari, Ta...
ISPDC
2003
IEEE
15 years 3 months ago
Lightweight Logging and Recovery for Distributed Shared Memory over Virtual Interface Architecture
As software Distributed Shared Memory(DSM) systems become attractive on larger clusters, the focus of attention moves toward improving the reliability of systems. In this paper, w...
Soyeon Park, Youngjae Kim, Seung Ryoul Maeng
ICS
2007
Tsinghua U.
15 years 3 months ago
GridRod: a dynamic runtime scheduler for grid workflows
Grid Workflows are emerging as practical programming models for solving large e-scientific problems on the Grid. However, it is typically assumed that the workflow components eith...
Shahaan Ayyub, David Abramson
SENSYS
2010
ACM
14 years 7 months ago
Surviving wi-fi interference in low power ZigBee networks
Frequency overlap across wireless networks with different radio technologies can cause severe interference and reduce communication reliability. The circumstances are particularly...
Chieh-Jan Mike Liang, Bodhi Priyantha, Jie Liu, An...