High-density LSI packages such as ball grid array (BGA) are being utilised in the car electronics and communications infrastructure products. These products require a high-speed a...
Light-weight embedded systems are now gaining more popularity due to the recent technological advances in fabrication that have resulted in more powerful tiny processors with grea...
As software Distributed Shared Memory(DSM) systems become attractive on larger clusters, the focus of attention moves toward improving the reliability of systems. In this paper, w...
Grid Workflows are emerging as practical programming models for solving large e-scientific problems on the Grid. However, it is typically assumed that the workflow components eith...
Frequency overlap across wireless networks with different radio technologies can cause severe interference and reduce communication reliability. The circumstances are particularly...
Chieh-Jan Mike Liang, Bodhi Priyantha, Jie Liu, An...