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» Requirements Development in Scenario-Based Design
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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
15 years 8 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
IUI
2010
ACM
15 years 6 months ago
Intelligent understanding of handwritten geometry theorem proving
Computer-based geometry systems have been widely used for teaching and learning, but largely based on mouse-andkeyboard interaction, these systems usually require users to draw fi...
Yingying Jiang, Feng Tian, Hongan Wang, Xiaolong Z...
WISEC
2009
ACM
15 years 6 months ago
Securing network access in wireless sensor networks
In wireless sensor networks, it is critical to restrict the network access only to eligible sensor nodes, while messages from outsiders will not be forwarded in the networks. In t...
Kun Sun, An Liu, Roger Xu, Peng Ning, W. Douglas M...
ATAL
2009
Springer
15 years 6 months ago
Towards multi-level modeling of self-assembling intelligent micro-systems
We investigate and model the dynamics of two-dimensional stochastic self-assembly of intelligent micro-systems with minimal requirements in terms of sensing, actuation, and contro...
Grégory Mermoud, Juergen Brugger, Alcherio ...
CASES
2009
ACM
15 years 6 months ago
An accelerator-based wireless sensor network processor in 130nm CMOS
Networks of ultra-low-power nodes capable of sensing, computation, and wireless communication have applications in medicine, science, industrial automation, and security. Over the...
Mark Hempstead, Gu-Yeon Wei, David Brooks