Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...
Jun Yang 0002, Xiuyi Zhou, Marek Chrobak, Youtao Z...
Energy management is a critical concern in the design of embedded systems to prolong the lifetime or to maximize the performance under energy constraints. In particular, the emerg...
—Parallel structures may be used to increase a system processing speed in case of large amount of data or highly complex calculations. Dynamic Voltage and Frequency Scaling (DVFS...
In future large-scale multi-core microprocessors, hard errors and process variations will create dynamic heterogeneity, causing performance and power characteristics to differ amo...