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Voted
WSC
2007
15 years 1 months ago
2007
The transition to 300mm wafer size introduced a lot of new technologies to wafer fabrication facilities that mandated the presence of intrabay automated material handling systems ...
WSC
2004
15 years 11 days ago
2004
Wafers in a 300-mm semiconductor fabrication facility are transported throughout the factory in carriers called front opening unified pods (FOUPs). Two standard capacities of FOUP...
WSC
1998
15 years 10 days ago
1998
The application of simulation as a performance estimation tool in automated material handling system design is well documented, as is the amount of time required to build, debug, ...