—Restoring data operations after a disaster is a daunting task: how should recovery be performed to minimize data loss and application downtime? Administrators are under consider...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
Because of the increasing dominance of interconnect issues in advanced IC technology, placement has become a critical step in the IC design flow. To get accurate interconnect inf...
Rapid improvements in network bandwidth, cost, and ubiquity combined with the security hazards and high total cost of ownership of personal computers have created a growing market...
With the explosive growth of digital cameras and online media, it has become crucial to design efficient methods that help users browse and search large image collections. The rec...
Liangliang Cao, Andrey Del Pozo, Xin Jin, Jiebo Lu...