433 search results - page 21 / 87 » Scale in Chip Interconnect requires Network Technology |
ESWS
2008
Springer
14 years 11 months ago
2008
Springer
Instant Messaging (IM) is in addition to Web and Email the most popular service on the Internet. With xOperator we present a strategy and implementation which deeply integrates Ins...
TCAD
2010
14 years 4 months ago
2010
The structural redundancy inherent to on-chip interconnection networks [networks on chip (NoC)] can be exploited by adaptive routing algorithms in order to provide connectivity eve...
ICCAD
2008
IEEE
15 years 6 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
CASES
2005
ACM
14 years 11 months ago
2005
ACM
Interconnection networks have been deployed as the communication fabric in a wide range of parallel computer systems. With recent technological trends allowing growing quantities ...
MICRO
2008
IEEE
15 years 4 months ago
2008
IEEE
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...