433 search results - page 42 / 87 » Scale in Chip Interconnect requires Network Technology |
DATE
2008
IEEE
15 years 4 months ago
2008
IEEE
With technology advances, the number of cores integrated on a chip and their speed of operation is increasing. This, in turn is leading to a significant increase in chip temperat...
TPDS
1998
14 years 9 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
ISCA
1999
IEEE
15 years 2 months ago
1999
IEEE
In the pursuit of instruction-level parallelism, significant demands are placed on a processor's instruction delivery mechanism. Delivering the performance necessary to meet ...
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
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HPCA
2007
IEEE
15 years 10 months ago
2007
IEEE
It is widely accepted that transient failures will appear more frequently in chips designed in the near future due to several factors such as the increased integration scale. On t...