433 search results - page 44 / 87 » Scale in Chip Interconnect requires Network Technology |
FPT
2005
IEEE
15 years 3 months ago
2005
IEEE
Designing Systems on-Chip is becoming increasingly popular as die sizes increase and technology sizes decrease. The complexity of integrating different types of Processing Element...
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
GLVLSI
2006
IEEE
15 years 3 months ago
2006
IEEE
A sensitivity analysis of resonant H-tree clock distribution networks is presented in this paper for a TSMC 0.18 μm CMOS technology. The analysis focuses on the effect of the dri...
ISLPED
2005
ACM
15 years 3 months ago
2005
ACM
As the number of cores on a chip increases, power consumed by the communication structures takes significant portion of the overall power-budget. The individual components of the...
ISCA
2000
IEEE
15 years 1 months ago
2000
IEEE
Trends in VLSI technology scaling demand that future computing devices be narrowly focused to achieve high performance and high efficiency, yet also target the high volumes and lo...