234 search results - page 31 / 47 » Scaling, Power and the Future of CMOS |
MICRO
2009
IEEE
15 years 4 months ago
2009
IEEE
Many-core scaling now faces a power wall. The gap between the number of cores that fit on a die and the number that can operate simultaneously under the power budget is rapidly i...
79
Voted
ISLPED
2005
ACM
15 years 3 months ago
2005
ACM
High power consumption and low energy efficiency have become significant impediments to future performance improvements in modern microprocessors. This paper contributes to the so...
74
Voted
DAC
2004
ACM
15 years 10 months ago
2004
ACM
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
84
Voted
DAC
2004
ACM
15 years 1 months ago
2004
ACM
The high leakage current in nano-meter regimes is becoming a significant portion of power dissipation in CMOS circuits as threshold voltage, channel length, and gate oxide thickne...
62
Voted
ASPDAC
2008
ACM
14 years 11 months ago
2008
ACM
Continuous transistor scaling due to improvements in CMOS devices and manufacturing technologies is increasing processor power densities and temperatures; thus, creating challenges...