Sciweavers

125 search results - page 24 / 25
» Sequential experimental design for misspecified nonlinear mo...
Sort
View
ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
15 years 6 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
99
Voted
MM
2006
ACM
203views Multimedia» more  MM 2006»
15 years 3 months ago
Learning image manifolds by semantic subspace projection
In many image retrieval applications, the mapping between highlevel semantic concept and low-level features is obtained through a learning process. Traditional approaches often as...
Jie Yu, Qi Tian
ECCV
2010
Springer
15 years 2 months ago
3D Point Correspondence by Minimum Description Length in Feature Space
Abstract. Finding point correspondences plays an important role in automatically building statistical shape models from a training set of 3D surfaces. For the point correspondence ...
ICDE
2000
IEEE
158views Database» more  ICDE 2000»
15 years 10 months ago
The DC-Tree: A Fully Dynamic Index Structure for Data Warehouses
: Many companies have recognized the strategic importance of the knowledge hidden in their large databases and have built data warehouses. Typically, updates are collected and appl...
Hans-Peter Kriegel, Jörn Kohlhammer, Martin E...
VLDB
2007
ACM
145views Database» more  VLDB 2007»
15 years 9 months ago
Executing Stream Joins on the Cell Processor
Low-latency and high-throughput processing are key requirements of data stream management systems (DSMSs). Hence, multi-core processors that provide high aggregate processing capa...
Bugra Gedik, Philip S. Yu, Rajesh Bordawekar