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TCAD
2011
14 years 4 months ago
2011
—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
IPPS
2008
IEEE
15 years 4 months ago
2008
IEEE
We present SNAP (Small-world Network Analysis and Partitioning), an open-source graph framework for exploratory study and partitioning of large-scale networks. To illustrate the c...
ECCV
2002
Springer
15 years 11 months ago
2002
Springer
This paper presents a novel approach for detecting affine invariant interest points. Our method can deal with significant affine transformations including large scale changes. Such...
ISPD
2003
ACM
15 years 2 months ago
2003
ACM
: Recent years have seen significant research in finding closed form expressions for the delay of an RC circuit that improves upon the Elmore delay model. However, several of these...
ICCAD
2009
IEEE
14 years 7 months ago
2009
IEEE
Pre-bond testing of 3D stacked ICs involves testing individual dies before bonding. The overall yield of 3D ICs improves with prebond testability because designers can avoid stack...