21 search results - page 3 / 5 » Signal integrity management in an SoC physical design flow |
ASPDAC
2006
ACM
14 years 6 days ago
2006
ACM
- Although the emerging three-dimensional integration technology can significantly reduce interconnect delay, chip area, and power dissipation in nanometer technologies, its impact...
TECS
2008
13 years 6 months ago
2008
straction SUDEEP PASRICHA and NIKIL DUTT University of California, Irvine and MOHAMED BEN-ROMDHANE Newport Media Inc. Currently, system-on-chip (SoC) designs are becoming increasin...
GLVLSI
2003
IEEE
13 years 11 months ago
2003
IEEE
Decreasing feature sizes and increasing package densities are making thermal issues extremely important in IC design. Uneven thermal maps and hot spots in ICs cause physical stres...
DATE
2003
IEEE
13 years 11 months ago
2003
IEEE
The new standard DRM for digital radio broadcast in AM band requires integrated devices for radio receivers at low cost and very low power consumption. A chipset is currently desi...
ICCAD
2006
IEEE
14 years 3 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...