1093 search results - page 160 / 219 » Simplifying parallel and distributed simulation with the DUP... |
166
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TPDS
1998
15 years 5 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
155
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ASAP
2005
IEEE
15 years 11 months ago
2005
IEEE
This paper explores low-power reliable microarchitectures for addition. Power, speed, and reliability (both defect- and fault-tolerance) are important metrics of system design, sp...
180
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MSS
1999
IEEE
15 years 10 months ago
1999
IEEE
Benchmark tests have been designed and conducted for the purpose of evaluating the use of automated tape libraries in on-line digital check image retrieval applications. This type...
150
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HPDC
2000
IEEE
15 years 10 months ago
2000
IEEE
While the MPP is still the most common architecture in supercomputer centers today, a simpler and cheaper machine configuration is growing increasingly common. This alternative s...
157
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IPPS
1998
IEEE
15 years 10 months ago
1998
IEEE
Switch-based interconnects are used in a number of application domains including parallel system interconnects, local area networks, and wide area networks. However, very few swit...