41 search results - page 7 / 9 » Simulated Annealing Based Temperature Aware Floorplanning |
ICCAD
2005
IEEE
15 years 6 months ago
2005
IEEE
Abstract— We present in this paper a new interconnect-driven multilevel floorplanning, called IMF, to handle large-scale building-module designs. Unlike the traditional multilev...
ISQED
2007
IEEE
15 years 3 months ago
2007
IEEE
In this paper, we address the interconnect-driven floorplanning problem that integrates OPC-friendly bus assignment with floorplanning. Buses consist of a number of horizontal/v...
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PDP
2011
IEEE
14 years 1 months ago
2011
IEEE
—Energy-efficiency is becoming one of the most critical issues in embedded system design. In Network-on-Chip (NoC) based heterogeneous Multiprocessor Systems, the energy consump...
ISPD
2005
ACM
15 years 3 months ago
2005
ACM
In this paper, we develop a mixed-size placement tool, Dragon2005, to solve large scale placement problems effectively. A top-down hierarchical approach based on min-cut partition...
DAC
2003
ACM
15 years 10 months ago
2003
ACM
We present in this paper a multilevel floorplanning/placement framework based on the B*-tree representation, called MB*-tree, to handle the floorplanning and packing for large-sca...