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116
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DAC
2010
ACM
15 years 7 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
111
Voted
HICSS
2008
IEEE
132views Biometrics» more  HICSS 2008»
15 years 10 months ago
Service Systems as Customer-Intensive Systems and Its Implications for Service Science and Engineering
What does differentiate service systems from traditional subjects of systems engineering such as manufacturing, and software? We address this issue by defining customer-intensive ...
Claudio S. Pinhanez
SASO
2008
IEEE
15 years 9 months ago
Designing Self-Organization for Evolvable Assembly Systems
Current solutions for industrial manufacturing assembly systems do not suit the needs of Mass Customization industry, which is facing low production volumes, many variants and rap...
Regina Frei, Giovanna Di Marzo Serugendo, Jos&eacu...
133
Voted
IWANN
2009
Springer
15 years 8 months ago
A Soft Computing System to Perform Face Milling Operations
In this paper we present a soft computing system developed to optimize the face milling operation under High Speed conditions in the manufacture of steel components like molds with...
Raquel Redondo, Pedro Santos, Andrés Bustil...
140
Voted
SIGOPSE
2000
ACM
15 years 7 months ago
Position paper: the role of platforms and operating systems in supporting home networks
As researchers look beyond the PC there is increasing interest in developing and deploying sophisticated home networks. Such networks might allow the seamless integration of infor...
Nigel Davies, Pierre-Guillaume Raverdy