1304 search results - page 105 / 261 » Simulation of Soliton Circuits |
ISCAS
2008
IEEE
15 years 4 months ago
2008
IEEE
—In this paper, an energy-efficient and high performance ternary content addressable memory (TCAM) are presented. It employs the concept of “green” microarchitecture and circ...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
DATE
2007
IEEE
15 years 4 months ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
87
Voted
AHS
2006
IEEE
15 years 4 months ago
2006
IEEE
The paper presents a novel integrated system in which a number of image processing algorithm are embedded within a Genetic Algorithm (GA) based framework in order to provide an ad...
EUC
2005
Springer
15 years 3 months ago
2005
Springer
This paper describes the design and evaluation of the PCA (Plastic Cell Architecture) cell, which implements a novel space allocation method. PCA is a dynamically reconfigurable a...