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DAC
2011
ACM
13 years 11 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
SYSTOR
2009
ACM
15 years 6 months ago
DHIS: discriminating hierarchical storage
A typical storage hierarchy comprises of components with varying performance and cost characteristics, providing multiple options for data placement. We propose and evaluate a hie...
Chaitanya Yalamanchili, Kiron Vijayasankar, Erez Z...
CCO
2001
Springer
161views Combinatorics» more  CCO 2001»
15 years 4 months ago
Branch, Cut, and Price: Sequential and Parallel
Branch, cut, and price (BCP) is an LP-based branch and bound technique for solving large-scale discrete optimization problems (DOPs). In BCP, both cuts and variables can be generat...
Laszlo Ladányi, Ted K. Ralphs, Leslie E. Tr...
INFOCOM
2000
IEEE
15 years 4 months ago
Topology Discovery in Heterogeneous IP Networks
Abstract— Knowledge of the up-to-date physical topology of an IP network is crucial to a number of critical network management tasks, including reactive and proactive resource ma...
Yuri Breitbart, Minos N. Garofalakis, Cliff Martin...
CIKM
2008
Springer
15 years 1 months ago
Learning a two-stage SVM/CRF sequence classifier
Learning a sequence classifier means learning to predict a sequence of output tags based on a set of input data items. For example, recognizing that a handwritten word is "ca...
Guilherme Hoefel, Charles Elkan