Technology scaling trends and the limitations of packaging and cooling have intensified the need for thermally efficient architectures and architecture-level temperature managemen...
Eren Kursun, Glenn Reinman, Suleyman Sair, Anahita...
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
: Ensemble Routing For Datacenter Networks Mike Schlansker, Yoshio Turner, Jean Tourrilhes, Alan Karp HP Laboratories HPL-2010-120 Networks, Ethernet, Multipath, Switching, Fault ...
Mike Schlansker, Yoshio Turner, Jean Tourrilhes, A...
The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor’s reliabili...
Jun Yang 0002, Xiuyi Zhou, Marek Chrobak, Youtao Z...
Dynamic Thermal Management (DTM) techniques have been proposed to save on thermal packaging and cooling costs for generalpurpose processors. However, when invoked, these technique...