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DAC
2011
ACM
14 years 3 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
195
Voted
VEE
2012
ACM
222views Virtualization» more  VEE 2012»
13 years 11 months ago
Unpicking the knot: teasing apart VM/application interdependencies
Flexible and efficient runtime design requires an understanding of the dependencies among the components internal to the runtime and those between the application and the runtime...
Yi Lin, Stephen M. Blackburn, Daniel Frampton
TOG
2012
171views Communications» more  TOG 2012»
13 years 5 months ago
HelpingHand: example-based stroke stylization
Digital painters commonly use a tablet and stylus to drive software like Adobe Photoshop. A high quality stylus with 6 degrees of freedom (DOFs: 2D position, pressure, 2D tilt, an...
Jingwan Lu, Fisher Yu, Adam Finkelstein, Stephen D...

Book
352views
17 years 1 months ago
Object-Oriented Reengineering Patterns
"The documentation is missing or obsolete, and the original developers have departed. Your team has limited understanding of the system, and unit tests are missing for many, i...
Serge Demeyer, Stéphane Ducasse, Oscar Nierstrasz
DAC
2007
ACM
16 years 4 months ago
Trusted Hardware: Can It Be Trustworthy?
Processing and storage of confidential or critical information is an every day occurrence in computing systems. The trustworthiness of computing devices has become an important co...
Cynthia E. Irvine, Karl N. Levitt
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