15777 search results - page 3015 / 3156 » Software Engineering |
145
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CODES
2007
IEEE
15 years 10 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
133
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CODES
2007
IEEE
15 years 10 months ago
2007
IEEE
Performance analysis of microprocessors is a critical step in defining the microarchitecture, prior to register-transfer-level (RTL) design. In complex chip multiprocessor systems...
136
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CODES
2007
IEEE
15 years 10 months ago
2007
IEEE
We address the problem of instruction selection for Multi-Output Instructions (MOIs), producing more than one result. Such inherently parallel hardware instructions are very commo...
137
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EMSOFT
2007
Springer
15 years 9 months ago
2007
Springer
Non-volatile RAM (NVRAM) such as PRAM (Phase-change RAM), FeRAM (Ferroelectric RAM), and MRAM (Magnetoresistive RAM) has characteristics of both non-volatile storage and random ac...
128
Voted
EMSOFT
2007
Springer
15 years 9 months ago
2007
Springer
Flash memory has many merits such as light weight, shock resistance, and low power consumption, but also has limitations like the erase-before-write property. To overcome such lim...