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DATE
2010
IEEE
162views Hardware» more  DATE 2010»
15 years 6 months ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
FPGA
1997
ACM
160views FPGA» more  FPGA 1997»
15 years 6 months ago
Architecture Issues and Solutions for a High-Capacity FPGA
ct High-capacity FPGAs pose device architects with a variety of problems. The most obvious of these problems is interconnect capacity. Others include interconnect performance, cloc...
Steven Trimberger, Khue Duong, Bob Conn
PROFES
2001
Springer
15 years 6 months ago
Evaluation of the E3 Process Modelling Language and Tool for the Purpose of Model Creation
In this paper, we report from an experiment which compared the E3 PML with respect to the standard modelling language IDEF0 for the purpose of model construction. The experiment ha...
Maria Letizia Jaccheri, Tor Stålhane
ICCAD
2002
IEEE
106views Hardware» more  ICCAD 2002»
15 years 10 months ago
Throughput-driven IC communication fabric synthesis
As the scale of system integration continues to grow, the on-chip communication becomes the ultimate bottleneck of system performance and the primary determinant of system archite...
Tao Lin, Lawrence T. Pileggi
DATE
2003
IEEE
69views Hardware» more  DATE 2003»
15 years 7 months ago
Performance-Directed Retiming for FPGAs Using Post-Placement Delay Information
In today’s deep-submicron designs, the interconnect delays contribute an increasing part to the overall performance of an implementation. Particularly when targeting field prog...
Ulrich Seidl, Klaus Eckl, Frank M. Johannes