: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
ct High-capacity FPGAs pose device architects with a variety of problems. The most obvious of these problems is interconnect capacity. Others include interconnect performance, cloc...
In this paper, we report from an experiment which compared the E3 PML with respect to the standard modelling language IDEF0 for the purpose of model construction. The experiment ha...
As the scale of system integration continues to grow, the on-chip communication becomes the ultimate bottleneck of system performance and the primary determinant of system archite...
In today’s deep-submicron designs, the interconnect delays contribute an increasing part to the overall performance of an implementation. Particularly when targeting field prog...