Abstract--This paper presents a multiparameter momentmatching-based model order reduction technique for parameterized interconnect networks via a novel two-directional Arnoldi proc...
Assessing IC manufacturing process fluctuations and their impacts on IC interconnect performance has become unavoidable for modern DSM designs. However, the construction of parame...
Peng Li, Frank Liu, Xin Li, Lawrence T. Pileggi, S...
In this paper, we present a reduced order inodeling methodology, based on the utilization of optimal non-uniform grids generated by Gaussian spectral rules, for the direct passive...
Traianos Yioultsis, Anne Woo, Andreas C. Cangellar...
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
Abstract. Power efficiency has become a key design trade-off in embedded system designs. For system-on-a-chip embedded systems, an external bus interconnects embedded processor co...