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DATE
2009
IEEE
113views Hardware» more  DATE 2009»
15 years 4 months ago
New simulation methodology of 3D surface roughness loss for interconnects modeling
— As clock frequencies exceed giga-Hertz, the extra power loss due to conductor surface roughness in interconnects and packagings is more evident and thus demands a proper accou...
Quan Chen, Ngai Wong
80
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ISQED
2007
IEEE
106views Hardware» more  ISQED 2007»
15 years 3 months ago
Passive Modeling of Interconnects by Waveform Shaping
In this paper, we propose a new approach to enforcing the passivity of a reduced system of general passive linear time invariant circuits. Instead of making the reduced models pas...
Boyuan Yan, Pu Liu, Sheldon X.-D. Tan, Bruce McGau...
ICCAD
2008
IEEE
147views Hardware» more  ICCAD 2008»
15 years 6 months ago
Overlay aware interconnect and timing variation modeling for double patterning technology
— As Double Patterning Technology (DPT) becomes the only solution for 32-nm lithography process, we need to investigate how DPT affects the performance of a chip. In this paper, ...
Jae-Seok Yang, David Z. Pan
ICCAD
1997
IEEE
91views Hardware» more  ICCAD 1997»
15 years 1 months ago
Interconnect layout optimization under higher-order RLC model
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model to optimize not just delay, but also waveform for RLC circuits with non-monoton...
Jason Cong, Cheng-Kok Koh
DATE
2010
IEEE
140views Hardware» more  DATE 2010»
15 years 2 months ago
Variation-aware interconnect extraction using statistical moment preserving model order reduction
—1 In this paper we present a stochastic model order reduction technique for interconnect extraction in the presence of process variabilities, i.e. variation-aware extraction. It...
Tarek A. El-Moselhy, Luca Daniel