9974 search results - page 37 / 1995 » Software Interconnection Models |
TVLSI
2010
14 years 8 months ago
2010
ICCAD
2004
IEEE
15 years 10 months ago
2004
IEEE
Thermal effects are becoming a limiting factor in highperformance circuit design due to the strong temperaturedependence of leakage power, circuit performance, IC package cost and...
121
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VLSI
2010
Springer
14 years 12 months ago
2010
Springer
—This paper proposes a novel technique to exploit the high bandwidth offered by through silicon vias (TSVs). In the proposed approach, synchronous parallel 3D links are replaced ...
115
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WCRE
1996
IEEE
15 years 5 months ago
1996
IEEE
The extraction of reusable software components from existing systems is an attractive idea. The goal of the work in this paper is not to extract a component automatically, but to ...
117
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CASES
2005
ACM
15 years 3 months ago
2005
ACM
Interconnection networks have been deployed as the communication fabric in a wide range of parallel computer systems. With recent technological trends allowing growing quantities ...