During semiconductor manufacturing, particles undesirably depose on the surface of the wafer causing “open” and “short” defects to interconnects. In this paper, a third ty...
Ever increasing complexity and heterogeneity of SoC platforms require diversified on-chip communication schemes beyond the currently omnipresent shared bus architectures. To prev...
Tim Kogel, Malte Doerper, Andreas Wieferink, Raine...
Abstract—This paper presents an accurate interconnect thermal model for analyzing the temperature distribution of an on-chip interconnect wire. The model addresses the ambient te...
Software architectures promote development focused on modular building blocks and their interconnections. Since architecture-level components often contain complex functionality, ...
Eric M. Dashofy, Nenad Medvidovic, Richard N. Tayl...
Early embedded SW development with transaction-level models has been broadly promoted to improve SoC design productivity. But the proposed APIs only provide low-level read/write o...