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166
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CASES
2010
ACM
15 years 3 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
178
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JOC
2010
15 years 28 days ago
2010
We describe several software side-channel attacks based on inter-process leakage through the state of the CPU's memory cache. This leakage reveals memory access patterns, whic...
141
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FOSAD
2007
Springer
16 years 9 days ago
2007
Springer
This article addresses two main topics. Firstly, we review the operation of trusted computing technology, which now appears likely to be implemented in future mobile devices (inclu...
150
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OOPSLA
2007
Springer
16 years 8 days ago
2007
Springer
This article describes the design and use of the CUTE C++ testing framework and its integration into the Eclipse C++ Development Tooling. Unit testing supports code quality and is...
144
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OOPSLA
2007
Springer
16 years 8 days ago
2007
Springer
RANDOOP FOR JAVA generates unit tests for Java code using feedback-directed random test generation. Below we describe RANDOOP’s input, output, and test generation algorithm. We ...