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CODES
2007
IEEE
15 years 8 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
ICSE
2010
IEEE-ACM
15 years 6 months ago
Customized awareness: recommending relevant external change events
It is often assumed that developers’ view of their system and its environment is always consistent with everyone else’s; in practice, this assumption can be false, as the deve...
Reid Holmes, Robert J. Walker
MAM
2006
125views more  MAM 2006»
15 years 1 months ago
Stream computations organized for reconfigurable execution
Reconfigurable systems can offer the high spatial parallelism and fine-grained, bit-level resource control traditionally associated with hardware implementations, along with the f...
André DeHon, Yury Markovsky, Eylon Caspi, M...
117
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IWPSE
2010
IEEE
14 years 11 months ago
Evolutional analysis of licenses in FOSS
FOSS (Free and Open Source System) is repeatedly modied and reused by other FOSS or proprietary software systems. They are released to others under specic licenses whose terms and...
Yuki Manabe, Yasuhiro Hayase, Katsuro Inoue
OOPSLA
2010
Springer
15 years 6 days ago
Collaborative model merging
Models are important artifacts in the software development life-cycle and are often the result of a collaborative activity of multiple developers. When multiple developers modify ...
Maximilian Koegel, Helmut Naughton, Jonas Helming,...