1547 search results - page 268 / 310 » Solving Knapsack Problems in a Sticker Based Model |
114
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IROS
2009
IEEE
15 years 9 months ago
2009
IEEE
— The problem of accurate 6-DoF pose estimation of 3D objects based on their shape has so far been solved only for specific object geometries. Edge-based recognition and trackin...
123
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ICCAD
2005
IEEE
15 years 12 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
123
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ICCD
2001
IEEE
15 years 12 months ago
2001
IEEE
Dynamic power is the main source of power consumption in CMOS circuits. It depends on the square of the supply voltage. It may significantly be reduced by scaling down the supply ...
115
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ECCV
2006
Springer
16 years 4 months ago
2006
Springer
We introduce a new approach to modelling gradient flows of contours and surfaces. While standard variational methods (e.g. level sets) compute local interface motion in a different...
147
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ECAL
2007
Springer
15 years 9 months ago
2007
Springer
Language can be viewed as a complex adaptive system which is continuously shaped and reshaped by the actions of its users as they try to solve communicative problems. To maintain c...