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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 1 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
173
Voted
ICPPW
2009
IEEE
15 years 10 months ago
Dynamic Control and Resource Allocation in Wireless-Infrastructured Distributed Cellular Networks with OFDMA
—In this paper, we consider joint optimization of end-to-end data transmission and resource allocation for Wireless-Infrastructured Distributed Cellular Networks (WIDCNs), where ...
Lei You, Ping Wu, Mei Song, Junde Song, Yong Zhang
CIKM
2009
Springer
15 years 10 months ago
Reducing the risk of query expansion via robust constrained optimization
We introduce a new theoretical derivation, evaluation methods, and extensive empirical analysis for an automatic query expansion framework in which model estimation is cast as a r...
Kevyn Collins-Thompson
KSEM
2009
Springer
15 years 10 months ago
A Competitive Learning Approach to Instance Selection for Support Vector Machines
Abstract. Support Vector Machines (SVM) have been applied successfully in a wide variety of fields in the last decade. The SVM problem is formulated as a convex objective function...
Mario Zechner, Michael Granitzer
COMPGEOM
2009
ACM
15 years 10 months ago
Embedding rivers in polyhedral terrains
Data conflation is a major issue in GIS: spatial data obtained from different sources, using different acquisition techniques, needs to be combined into one single consistent d...
Marc J. van Kreveld, Rodrigo I. Silveira