As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
We have developed a model-based, distributed architecture that integrates diverse components in a system designed for lunar and planetary surface operations: an astronaut’s spac...
William J. Clancey, Maarten Sierhuis, Charis Kaski...
Heterogeneous multihop wireless networks such as wireless mesh networks consist of a set of resource-constrained mobile nodes that want to communicate with each other and a set of...
Many emerging mobile wireless applications depend upon secure group communications, in which data is encrypted and the group's data encryption key is changed whenever a membe...
Chun Zhang, Brian DeCleene, James F. Kurose, Donal...
Success of Wireless Sensor Networks (WSN) largely depends on whether the deployed network can provide desired area coverage with acceptable network lifetime. This paper seeks to a...