: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Projected computational requirements for future space missions are outpacing technologies and trends in conventional embedded microprocessors. In order to meet the necessary levels...
Adam Jacobs, Grzegorz Cieslewski, Casey Reardon, A...
A new topic of great relevance and concern has been the design of efficient early warning systems to detect as soon as possible the emergence of spatial clusters. In particular, m...
The increasingly complicated DSP processors and applications with strict timing and code size constraints require design automation tools to consider multiple optimizations such a...
Qingfeng Zhuge, Chun Xue, Zili Shao, Meilin Liu, M...
The authoring of fictional stories is considered a creative process. The purpose of most story authoring is not to invent a new style or genre of story that will be accepted by the...