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3DIC
2009
IEEE
153views Hardware» more  3DIC 2009»
15 years 4 months ago
Junction-level thermal extraction and simulation of 3DICs
Abstract—In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the ...
Samson Melamed, Thorlindur Thorolfsson, Adi Sriniv...
CVPR
2009
IEEE
15 years 4 months ago
Learning multi-modal densities on Discriminative Temporal Interaction Manifold for group activity recognition
While video-based activity analysis and recognition has received much attention, existing body of work mostly deals with single object/person case. Coordinated multi-object activi...
Ruonan Li, Rama Chellappa, Shaohua Kevin Zhou
DAC
2009
ACM
15 years 4 months ago
Variational capacitance extraction of on-chip interconnects based on continuous surface model
In this paper we present a continuous surface model to describe the interconnect geometric variation, which improves the currently used model for better accuracy while not increas...
Wenjian Yu, Chao Hu, Wangyang Zhang
GIS
2009
ACM
15 years 4 months ago
Proximate sensing using georeferenced community contributed photo collections
Volunteered geographic information such as that available in blogs, wikis, social networking sites, and community contributed photo collections is enabling new applications. This ...
Daniel Leung, Shawn Newsam
ICASSP
2009
IEEE
15 years 4 months ago
Perceptual quality based packet dropping for generalized video GOP structures
Our work builds a general visibility model of video packets which is applicable to various types of GOP (Group of Pictures). The data used for analysis and building the model come...
Ting-Lan Lin, Yuan Zhi, Sandeep Kanumuri, Pamela C...