279 search results - page 38 / 56 » Stacked Hierarchical Labeling |
87
Voted
DATE
2009
IEEE
15 years 6 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
112
click to vote
DCOSS
2005
Springer
15 years 5 months ago
2005
Springer
In wireless sensor networks, energy and communication bandwidth are precious resources. Traditionally, layering has been used as a design principle for network stacks; hence routin...
101
click to vote
DFT
2003
IEEE
15 years 5 months ago
2003
IEEE
This paper discusses a hybrid optoelectronic scheme for a new interconnection network, "Tori connected mESHes (TESH)". The major features of TESH are the following: it i...
JCM
2006
14 years 11 months ago
2006
There are many difficult challenges ahead in the design of an energy-efficient communication stack for wireless sensor networks. Due to the severe sensor node constraints, protocol...
100
click to vote
IEEECIT
2010
IEEE
14 years 10 months ago
2010
IEEE
—The complexity of modern networked information systems, as well as all the defense-in-depth best practices, require distributed intrusion detection architectures relying on the ...