279 search results - page 38 / 56 » Stacked Hierarchical Labeling |
DATE
2009
IEEE
15 years 4 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
100
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DCOSS
2005
Springer
15 years 3 months ago
2005
Springer
In wireless sensor networks, energy and communication bandwidth are precious resources. Traditionally, layering has been used as a design principle for network stacks; hence routin...
91
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DFT
2003
IEEE
15 years 2 months ago
2003
IEEE
This paper discusses a hybrid optoelectronic scheme for a new interconnection network, "Tori connected mESHes (TESH)". The major features of TESH are the following: it i...
JCM
2006
14 years 9 months ago
2006
There are many difficult challenges ahead in the design of an energy-efficient communication stack for wireless sensor networks. Due to the severe sensor node constraints, protocol...
IEEECIT
2010
IEEE
14 years 8 months ago
2010
IEEE
—The complexity of modern networked information systems, as well as all the defense-in-depth best practices, require distributed intrusion detection architectures relying on the ...