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3DIC
2009
IEEE
279views Hardware» more  3DIC 2009»
15 years 7 months ago
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, ...
MICCAI
2000
Springer
15 years 4 months ago
Segmentation by Adaptive Geodesic Active Contours
This paper introduces the use of spatially adaptive components into the geodesic active contour segmentation method for application to volumetric medical images. These components a...
Carl-Fredrik Westin, Liana M. Lorigo, Olivier D. F...
122
Voted
ECCV
2010
Springer
15 years 1 months ago
Intrinsic Regularity Detection in 3D Geometry
Abstract. Automatic detection of symmetries, regularity, and repetitive structures in 3D geometry is a fundamental problem in shape analysis and pattern recognition with applicatio...
Niloy J. Mitra, Alexander M. Bronstein, Michael M....
PR
2008
159views more  PR 2008»
15 years 22 days ago
A two-stage head pose estimation framework and evaluation
Head pose is an important indicator of a person's focus of attention. Also, head pose estimation can be used as the front-end analysis for multi-view face analysis. For examp...
Junwen Wu, Mohan M. Trivedi
CVPR
2008
IEEE
16 years 2 months ago
Real-time pose estimation of articulated objects using low-level motion
We present a method that is capable of tracking and estimating pose of articulated objects in real-time. This is achieved by using a bottom-up approach to detect instances of the ...
Ben Daubney, David P. Gibson, Neill W. Campbell