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ISLPED
2006
ACM
99views Hardware» more  ISLPED 2006»
15 years 3 months ago
Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
Hao Yu, Yiyu Shi, Lei He, Tanay Karnik
ASAP
2005
IEEE
169views Hardware» more  ASAP 2005»
15 years 3 months ago
Alleviating the Data Memory Bandwidth Bottleneck in Coarse-Grained Reconfigurable Arrays
It is widely known that parallel operation execution in multiprocessor systems generates a respective increase in memory accesses. Since the memory and bus subsystems provide a li...
Grigoris Dimitroulakos, Michalis D. Galanis, Costa...
EEE
2005
IEEE
15 years 3 months ago
Feature Selection Methods for Conversational Recommender Systems
This paper focuses on question selection methods for conversational recommender systems. We consider a scenario, where given an initial user query, the recommender system may ask ...
Nader Mirzadeh, Francesco Ricci, Mukesh Bansal
ICRA
2005
IEEE
164views Robotics» more  ICRA 2005»
15 years 3 months ago
Active Control of Configuration-Dependent Linkage Vibration with Application to a Planar Parallel Platform
—A new lightweight planar parallel platform aims to greatly improve operational speed of electronic manufacturing process and to realize a “smart parallel platform” through t...
Xiaoyun Wang, James K. Mills
ISQED
2005
IEEE
125views Hardware» more  ISQED 2005»
15 years 3 months ago
A New Method for Design of Robust Digital Circuits
As technology continues to scale beyond 100nm, there is a significant increase in performance uncertainty of CMOS logic due to process and environmental variations. Traditional c...
Dinesh Patil, Sunghee Yun, Seung-Jean Kim, Alvin C...