897 search results - page 117 / 180 » System-Level Design for FPGAs |
148
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VLSID
2010
IEEE
15 years 2 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...
163
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DAC
1999
ACM
15 years 9 months ago
1999
ACM
This paper presents a novel approach for synthesis of analog systems from behavioral VHDL-AMS specifications. We implemented this approach in the VASE behavioral-synthesis tool. ...
214
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OSDI
2008
ACM
16 years 4 months ago
2008
ACM
SR-IOV capable network devices offer the benefits of direct I/O throughput and reduced CPU utilization while greatly increasing the scalability and sharing capabilities of the devi...
180
Voted
CODES
2011
IEEE
14 years 4 months ago
2011
IEEE
The paper presents an overview of a major research project on dependable embedded systems that has started in Fall 2010 and is running for a projected duration of six years. Aim i...
137
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DATE
2008
IEEE
15 years 11 months ago
2008
IEEE
In the last decade, the focus of fault-tolerance methods has tended towards circuit level modifications, such as transistor resizing, and away from expensive system level redunda...