1177 search results - page 15 / 236 » System-in-Package Testing: Problems and Solutions |
112
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ETS
2010
IEEE
15 years 27 days ago
2010
IEEE
Testing of 3D stacked ICs (SICs) is becoming increasingly important in the semiconductor industry. In this paper, we address the problem of test architecture optimization for 3D s...
111
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CP
2009
Springer
15 years 3 months ago
2009
Springer
Abstract. This paper considers the automatic generation of architectural tests (ATGP), a fundamental problem in processor validation. ATGPs are complex conditional constraint satis...
ANOR
2010
14 years 12 months ago
2010
This paper presents two novel genetic algorithms (GAs) for hard industrially relevant packing problems. The design of both algorithms is inspired by aspects of molecular genetics,...
INFORMATICALT
2006
14 years 11 months ago
2006
Recently, genetic algorithms (GAs) and their hybrids have achieved great success in solving difficult combinatorial optimization problems. In this paper, the issues related to the ...
103
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COR
2008
14 years 11 months ago
2008
The two-dimensional orthogonal packing problem (2OPP) consists in determining if a set of rectangles can be packed in a larger rectangle of fixed size. We propose an exact method ...