3 search results - page 1 / 1 » Temperature aware microprocessor floorplanning considering a... |
ICCAD
2007
IEEE
15 years 9 months ago
2007
IEEE
This paper studies microprocessor floorplanning considering thermal and throughput optimization. We first develop a stochastic heat diffusion model taking into account the appl...
122
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TPDS
2008
15 years 3 days ago
2008
Multicore architectures have been ruling the recent microprocessor design trend. This is due to different reasons: better performance, thread-level parallelism bounds in modern app...
109
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VLSID
2010
IEEE
14 years 10 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...