27 search results - page 2 / 6 » Temperature-aware routing in 3D ICs |
ISPD
2012
ACM
12 years 1 months ago
2012
ACM
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...
DAC
2011
ACM
12 years 6 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
ASPDAC
2006
ACM
14 years 7 days ago
2006
ACM
Three-dimensional integrated circuits (3D ICs) provide an attractive solution for improving circuit performance. Such solutions must be embedded in an electrothermally-conscious d...
DATE
2009
IEEE
14 years 1 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
ASPDAC
2005
ACM
13 years 12 months ago
2005
ACM
3-D IC has a great potential for improving circuit performance and degree of integration. It is also an attractive platform for system-on-chip or system-in-package solutions. A cr...