Sciweavers

27 search results - page 6 / 6
» Temperature-aware routing in 3D ICs
Sort
View
ISCAS
2006
IEEE
112views Hardware» more  ISCAS 2006»
14 years 9 days ago
Inductance extraction for general interconnect structures
As the operation frequency reaches gigahertz in very deep-submicron designs, the effect of on-chip inductance on circuit performance can no longer be neglected. Therefore, it is d...
Chun-Ying Lai, Shyh-Kang Jeng, Yao-Wen Chang, Chia...
DAC
2007
ACM
13 years 10 months ago
CAD Implications of New Interconnect Technologies
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
Louis Scheffer