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DAC
2010
ACM
15 years 7 months ago
TSV stress aware timing analysis with applications to 3D-IC layout optimization
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Jae-Seok Yang, Krit Athikulwongse, Young-Joon Lee,...
IPSN
2010
Springer
15 years 10 months ago
KleeNet: discovering insidious interaction bugs in wireless sensor networks before deployment
Complex interactions and the distributed nature of wireless sensor networks make automated testing and debugging before deployment a necessity. A main challenge is to detect bugs ...
Raimondas Sasnauskas, Olaf Landsiedel, Muhammad Ha...
132
Voted
RSS
2007
107views Robotics» more  RSS 2007»
15 years 4 months ago
Safety Evaluation of Physical Human-Robot Interaction via Crash-Testing
— The light-weight robots developed at the German Aerospace Center (DLR) are characterized by their low inertial properties, torque sensing in each joint and a load to weight rat...
Sami Haddadin, Alin Albu-Schäffer, Gerd Hirzi...
223
Voted
ICDE
2007
IEEE
138views Database» more  ICDE 2007»
16 years 4 months ago
ICEDB: Intermittently-Connected Continuous Query Processing
Current distributed database and stream processing systems assume that the network connecting nodes in the data processor is "always on," and that the absence of a netwo...
Yang Zhang, Bret Hull, Hari Balakrishnan, Samuel M...
DSRT
2006
IEEE
15 years 9 months ago
Speedup-Precision Tradeoffs in Time-Parallel Simulation of Wireless Ad hoc Networks
In this paper, we report on a series of experiments involving the speedups obtainable with time-parallel simulation of wireless ad hoc networks. A mobile ad hoc network scenario i...
Damla Turgut, Guoqiang Wang, Ladislau Böl&oum...