As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Complex interactions and the distributed nature of wireless sensor networks make automated testing and debugging before deployment a necessity. A main challenge is to detect bugs ...
Raimondas Sasnauskas, Olaf Landsiedel, Muhammad Ha...
— The light-weight robots developed at the German Aerospace Center (DLR) are characterized by their low inertial properties, torque sensing in each joint and a load to weight rat...
Current distributed database and stream processing systems assume that the network connecting nodes in the data processor is "always on," and that the absence of a netwo...
Yang Zhang, Bret Hull, Hari Balakrishnan, Samuel M...
In this paper, we report on a series of experiments involving the speedups obtainable with time-parallel simulation of wireless ad hoc networks. A mobile ad hoc network scenario i...