1641 search results - page 84 / 329 » The 3D visibility complex |
CGF
2010
14 years 10 months ago
2010
We address the problem of generating quality surface triangle meshes from 3D point clouds sampled on piecewise smooth surfaces. Using a feature detection process based on the cova...
CORR
2008
Springer
14 years 10 months ago
2008
Springer
Emerging 3D chips stacking and MEMS/Sensors packaging technologies are using DRIE (Deep Reactive Ion Etching) to etch Through-Silicon Via (TSV) for advanced interconnections. The ...
TOG
2008
14 years 9 months ago
2008
We introduce a computational framework for discovering regular or repeated geometric structures in 3D shapes. We describe and classify possible regular structures and present an e...
IJCV
2000
14 years 9 months ago
2000
We describe how to model the appearance of a 3-D object using multiple views, learn such a model from training images, and use the model for object recognition. The model uses pro...
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CGF
1998
14 years 9 months ago
1998
A multiresolution data decomposition offers a fundamental framework supporting compression, progressive transmission, and level-of-detail (LOD) control for large two or three dime...