1641 search results - page 90 / 329 » The 3D visibility complex |
TCSV
2008
14 years 9 months ago
2008
Abstract--Various 3-D face synthesis techniques have been proposed and extensively used in many applications. Compared with others, single view-based face synthesis technology allo...
HPCA
2009
IEEE
15 years 10 months ago
2009
IEEE
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
BMCBI
2007
14 years 10 months ago
2007
Background: Since many of the new protein structures delivered by high-throughput processes do not have any known function, there is a need for structure-based prediction of prote...
VLSID
2007
IEEE
15 years 10 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
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NANONET
2009
Springer
15 years 2 months ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...