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HPCA
2009
IEEE
15 years 10 months ago
A low-radix and low-diameter 3D interconnection network design
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
VLSID
2006
IEEE
129views VLSI» more  VLSID 2006»
15 years 10 months ago
A Stimulus-Free Probabilistic Model for Single-Event-Upset Sensitivity
With device size shrinking and fast rising frequency ranges, effect of cosmic radiations and alpha particles known as Single-Event-Upset (SEU), Single-Eventtransients (SET), is a ...
Mohammad Gh. Mohammad, Laila Terkawi, Muna Albasma...
MOBIHOC
2008
ACM
15 years 9 months ago
Rendezvous design algorithms for wireless sensor networks with a mobile base station
Recent research shows that significant energy saving can be achieved in wireless sensor networks with a mobile base station that collects data from sensor nodes via short-range co...
Guoliang Xing, Tian Wang, Weijia Jia, Minming Li
IPPS
2008
IEEE
15 years 4 months ago
Parallel IP lookup using multiple SRAM-based pipelines
Pipelined SRAM-based algorithmic solutions have become competitive alternatives to TCAMs (ternary content addressable memories) for high throughput IP lookup. Multiple pipelines c...
Weirong Jiang, Viktor K. Prasanna
MICRO
2008
IEEE
114views Hardware» more  MICRO 2008»
15 years 4 months ago
Toward a multicore architecture for real-time ray-tracing
Significant improvement to visual quality for real-time 3D graphics requires modeling of complex illumination effects like soft-shadows, reflections, and diffuse lighting intera...
Venkatraman Govindaraju, Peter Djeu, Karthikeyan S...