17409 search results - page 311 / 3482 » The Design and Performance of MedJava |
132
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ICCAD
2006
IEEE
16 years 29 days ago
2006
IEEE
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
113
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DATE
2009
IEEE
15 years 10 months ago
2009
IEEE
—In this paper, we propose a scalable and transparent parallelization scheme using threads for multi-core processor. The performance achieved by our scheme is scalable to the num...
114
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IJCNN
2008
IEEE
15 years 10 months ago
2008
IEEE
— The purpose of this study was to develop a product design model for impact toughness estimation of low-alloy steel plates. Based on these estimates, the rejection probability o...
117
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ISCA
2007
IEEE
15 years 10 months ago
2007
IEEE
The ever increasing sizes of on-chip caches and the growing domination of wire delay necessitate significant changes to cache hierarchy design methodologies. Many recent proposal...
152
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ITNG
2007
IEEE
15 years 10 months ago
2007
IEEE
In this paper, we present several enhanced network techniques which are appropriate for VLSI implementation and have reduced complexity, high throughput, and simple routing algori...