As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
The relatively poor scaling of interconnect in modern digital circuits necessitates a number of design optimizations, which must typically be iterated several times to meet the spe...
Business has been highlighted as a one of the critical dimensions of software product line engineering. This paper’s main contribution is to increase the understanding of the in...
Abstract--An error resilient video streaming scheme that transmits offline coded H.264/AVC video through erroneous channels, called the alternative macroblock coding (AMC) scheme, ...
Abstract--Network intrusion detection systems (NIDSs) monitor network traffic for suspicious activity and alert the system or network administrator. With the onset of gigabit netwo...
Abhishek Das, David Nguyen, Joseph Zambreno, Gokha...